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 ZXMD63N03X
DUAL 30V N-CHANNEL ENHANCEMENT MODE MOSFET
SUMMARY V(BR)DSS=30V; RDS(ON)=0.135 ; ID=2.3A
DESCRIPTION This new generation of high density MOSFETs from Zetex utilises a unique structure that combines the benefits of low on-resistance with fast switching speed. This makes them ideal for high efficiency, low voltage, power management applications. FEATURES * * * * * * * * * Low on-resistance Fast switching speed Low threshold Low gate drive Low profile SOIC package
MSOP8
APPLICATIONS DC - DC Converters Power Management Functions Disconnect switches Motor control
ORDERING INFORMATION
DEVICE ZXMD63N03XTA ZXMD63N03XTC REEL SIZE (inches) 7 13 TAPE WIDTH (mm) 12mm embossed 12mm embossed QUANTITY PER REEL 1000 units 4000 units
Top View
DEVICE MARKING * ZXM63N03
PROVISIONAL ISSUE A - JULY 1999 33
ZXMD63N03X
ABSOLUTE MAXIMUM RATINGS.
PARAMETER Drain-Source Voltage Gate- Source Voltage Continuous Drain Current (V GS=4.5V; T A=25C)(b)(d) (V GS=4.5V; T A=70C)(b)(d) Pulsed Drain Current (c)(d) Continuous Source Current (Body Diode)(b)(d) Pulsed Source Current (Body Diode)(c)(d) Power Dissipation at T A=25C (a)(d) Linear Derating Factor Power Dissipation at T A=25C (a)(e) Linear Derating Factor Power Dissipation at T A=25C (b)(d) Linear Derating Factor Operating and Storage Temperature Range SYMBOL V DSS V GS ID I DM IS I SM PD PD PD T j:T stg LIMIT 30 20 2.3 1.8 14 1.5 14 0.87 6.9 1.04 8.3 1.25 10 -55 to +150 UNIT V V A A A A W mW/C W mW/C W mW/C C
THERMAL RESISTANCE
PARAMETER Junction to Ambient (a)(d) Junction to Ambient (b)(d) Junction to Ambient (a)(e) SYMBOL R JA R JA R JA VALUE 143 100 120 UNIT C/W C/W C/W
NOTES (a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions (b) For a device surface mounted on FR4 PCB measured at t 10 secs. (c) Repetitive rating - pulse width limited by maximum junction temperature. Refer to Transient Thermal Impedance graph. (d) For device with one active die. (e) For device with two active die running at equal power.
PROVISIONAL ISSUE A - JULY 1999 34
ZXMD63N03X
CHARACTERISTICS
100
Refer Note (a)
Max Power Dissipation (Watts)
1.4 1.2 1.0 0.8 0.6 0.4 0.2 0
ID - Drain Current (A)
10
Refer Note (b) Refer Note (a)
10
DC 1s 100ms 10ms 1ms 100us
0.1
0.1
10
10
100
0
20
40
60
80
100
120
140
160
VDS - Drain-Source Voltage (V)
T - Temperature ()
Safe Operating Area
Derating Curve
Refer Note (b)
Thermal Resistance (C/W)
120
160 140 120 100 80 60 40 20
D=0.2 D=0.1 D=0.05 D=0.5 Refer Note (a)
Thermal Resistance (C/W)
100 80 60
D=0.5
40 20
D=0.2 D=0.1 D=0.05
0 0.0001
Single Pulse
0.001
0.01
0.1
1
10
100
0 0.0001
Single Pulse
0.001
0.01
0.1
1
10
100
1000
Pulse Width (s)
Pulse Width (s)
Transient Thermal Impedance
Transient Thermal Impedance
PROVISIONAL ISSUE A - JULY 1999 35
ZXMD63N03X
ELECTRICAL CHARACTERISTICS (at Tamb = 25C unless otherwise stated).
PARAMETER STATIC Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Body Leakage Gate-Source Threshold Voltage Static Drain-Source On-State Resistance (1) Forward Transconductance (3) DYNAMIC (3) Input Capacitance Output Capacitance Reverse Transfer Capacitance SWITCHING(2) (3) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate-Source Charge Gate Drain Charge SOURCE-DRAIN DIODE Diode Forward Voltage (1) Reverse Recovery Time (3) Reverse Recovery Charge(3) V SD t rr Q rr 16.9 9.5 0.95 V ns nC T j=25C, I S=1.7A, V GS=0V T j=25C, I F=1.7A, di/dt= 100A/s t d(on) tr t d(off) tf Qg Q gs Q gd 2.5 4.1 9.6 4.4 8 1.2 2 ns ns ns ns nC nC nC V DS=24V,V GS=10V, I D =1.7A (Refer to test circuit) V DD =15V, I D=1.7A R G=6.1, R D=8.7 (Refer to test circuit) C iss C oss C rss 290 70 20 pF pF pF V DS=25 V, V GS=0V, f=1MHz V (BR)DSS I DSS I GSS V GS(th) R DS(on) g fs 1.9 1.0 0.135 0.200 30 1 100 V A nA V S I D=250A, V GS=0V V DS=30V, V GS=0V V GS= 20V, V DS=0V I D =250A, V DS= V GS V GS=10V, I D=1.7A V GS=4.5V, I D=0.85A V DS=10V,I D=0.85A SYMBOL MIN. TYP. MAX. UNIT CONDITIONS.
(1) Measured under pulsed conditions. Width=300s. Duty cycle 2% . (2) Switching characteristics are independent of operating junction temperature. (3) For design aid only, not subject to production testing.
PROVISIONAL ISSUE A - JULY 1999 36
ZXMD63N03X
TYPICAL CHARACTERISTICS
100
+25C
100
+150C
ID - Drain Current (A)
10V 8V 7V 6V 5V
10
VGS 4.5V 4V 3.5V
ID - Drain Current (A)
10V 8V 7V 6V
10
VGS 5V 4.5V 4V 3.5V
1
3V
1
3V
0.1
0.1
1
10
100
0.1
0.1
1
10
100
VDS - Drain-Source Voltage (V)
VDS - Drain-Source Voltage (V)
Output Characteristics
Output Characteristics
100
VDS=10V
Normalised RDS(on) and VGS(th)
1.8 1.6
RDS(on)
ID - Drain Current (A)
1.4 1.2 1.0 0.8 0.6 0.4 -100
10
VGS=10V ID=1.7A
T=150C
1
T=25C
VGS=VDS ID=250uA VGS(th)
0.1
2
2.5
3
3.5
4
4.5
5
5.5
6
-50
0
50
100
150
200
VGS - Gate-Source Voltage (V)
Tj - Junction Temperature (C)
Typical Transfer Characteristics
Normalised RDS(on) and VGS(th) v Temperature
ISD - Reverse Drain Current (A)
100
RDS(on) - Drain-Source On-Resistance ()
10
1 VGS=3V VGS=4.5V 0.1 VGS=10V
10
1 T=150 C T=25 C 0.1
0.01
0.1
1
10
100
0.2
0.4
0.6
0.8
1.0
1.2
1.4
ID - Drain Current (A)
VSD - Source-Drain Voltage (V)
On-Resistance v Drain Current
Source-Drain Diode Forward Voltage
PROVISIONAL ISSUE A - JULY 1999 37
ZXMD63N03X
TYPICAL CHARACTERISTICS
450
Vgs=0V f=1Mhz Ciss Coss Crss
VGS - Gate-Source Voltage (V)
500
10 9 8 7 6 5 4 3 2 1 0 0 1 2 3 4 5 6 7 8
VDS=15V VDS=24V ID=1.7A
C - Capacitance (pF)
400 350 300 250 200 150 100 50 0 0.1 1 10
100
VDS - Drain Source Voltage (V)
Q -Charge (nC)
Capacitance v Drain-Source Voltage
Gate-Source Voltage v Gate Charge
Basic Gate Charge Waveform
Gate Charge Test Circuit
Switching Time Waveforms
Switching Time Test Circuit
PROVISIONAL ISSUE A - JULY 1999 38
ZXMD63N03X
PACKAGE DIMENSIONS
D
DIM
Millimetres MIN MAX 1.10 0.05 0.25 0.13 2.90 0.65 2.90 4.90 0.40 0 0.15 0.40 0.23 3.10 BSC 3.10 BSC 0.70 6
Inches MIN MAX 0.043 0.002 0.010 0.005 0.114 0.0256 0.114 0.193 0.016 0 0.006 0.016 0.009 0.122 BSC 0.122 BSC 0.028 6
A
8 7 65
A1
E H
1 2 34
B C
eX6
D e
A1
E
B C L
A
H L q
Conforms to JEDEC MO-187 Iss A
PAD LAYOUT DETAILS
Zetex plc. Fields New Road, Chadderton, Oldham, OL9-8NP, United Kingdom. Telephone: (44)161 622 4422 (Sales), (44)161 622 4444 (General Enquiries) Fax: (44)161 622 4420 Zetex GmbH Streitfeldstrae 19 D-81673 Munchen Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 Zetex Inc. 47 Mall Drive, Unit 4 Commack NY 11725 USA Telephone: (516) 543-7100 Fax: (516) 864-7630 Zetex (Asia) Ltd. 3510 Metroplaza, Tower 2 Hing Fong Road, Kwai Fong, Hong Kong Telephone:(852) 26100 611 Fax: (852) 24250 494 These are supported by agents and distributors in major countries world-wide (c)Zetex plc 1999 Internet:http://www.zetex.com
This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
PROVISIONAL ISSUE A - JULY 1999 40


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